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general description the max12529 is a dual, 96msps, 12-bit analog-to-digi- tal converter (adc) featuring fully differential wideband track-and-hold (t/h) inputs, driving internal quantizers. the max12529 is optimized for low power, small size, and high dynamic performance in intermediate frequen- cy (if) and baseband sampling applications. this dual adc operates from a single 3.3v supply, consuming only 980mw while delivering a typical 69.7db signal-to- noise ratio (snr) performance at a 175mhz input fre- quency. the t/h input stages accept single-ended or differential inputs up to 350mhz. in addition to low oper- ating power, the max12529 features a 0.66mw power- down mode to conserve power during idle periods. a flexible reference structure allows the max12529 to use the internal 2.048v bandgap reference or accept an externally applied reference and allows the refer- ence to be shared between the two adcs. the refer- ence structure allows the full-scale analog input range to be adjusted from ?.35v to ?.15v. the max12529 provides a common-mode reference to simplify design and reduce external component count in differential analog input circuits. the max12529 supports either a single-ended or differ- ential input clock. user-selectable divide-by-two (div2) and divide-by-four (div4) modes allow for design flexibil- ity and help eliminate the negative effects of clock jitter. wide variations in the clock duty cycle are compensated with the adc? internal duty-cycle equalizer (dce). the max12529 features two parallel, 12-bit-wide, cmos-compatible outputs. the digital output format is pin-selectable to be either two? complement or gray code. a separate power-supply input for the digital out- puts accepts a 1.7v to 3.6v voltage for flexible interfac- ing with various logic levels. the max12529 is available in a 10mm x 10mm x 0.8mm, 68-pin thin qfn package with exposed paddle (ep), and is specified for the extended (-40 c to +85 c) temperature range. applications if and baseband communication receivers cellular, lmds, point-to-point microwave, mmds, hfc, wlan i/q receivers medical imaging portable instrumentation digital set-top boxes low-power data acquisition features ? direct if sampling up to 350mhz ? excellent dynamic performance 70.1db/69.7db snr at f in = 70mhz/175mhz 83.2dbc/78.9dbc sfdr at f in = 70mhz/175mhz ? 3.3v low-power operation 980mw (differential clock mode) 952mw (single-ended clock mode) ? fully differential or single-ended analog input ? adjustable differential analog input voltage ? 750mhz input bandwidth ? internal, external, or shared reference ? differential or single-ended clock ? accepts 25% to 75% clock duty cycle ? user-selectable div2 and div4 clock modes ? power-down mode ? cmos outputs in two? complement or gray code ? out-of-range and data-valid indicators ? compact, 68-pin thin qfn package (10mm x 10mm x 0.8mm) ? evaluation kit available (order max12529evkit) max12529 dual, 96msps, 12-bit, if/baseband adc ________________________________________________________________ maxim integrated products 1 ordering information 19-3927; rev 1; 5/07 evaluation kit available part temp range pin-package pkg code m ax 12529e tk- d - 40 c to + 85 c 68 thi n qfn - e p * t6800- 4 m ax 12529e tk+ d - 40 c to + 85 c 68 thi n qfn - e p * t6800- 4 pin configuration appears at end of data sheet. selector guide part sampling rate (msps) resolution (bits) max12559 96 14 max12558 80 14 max12557 65 14 max12529 96 12 max12528 80 12 max12527 65 12 * ep = exposed paddle. + denotes lead-free package. d = dry pack. for pricing, delivery, and ordering information, please contact maxim direct at 1-888-629-4642, or visit maxim's website at www.maxim-ic.com.
max12529 dual, 96msps, 12-bit, if/baseband adc 2 _______________________________________________________________________________________ absolute maximum ratings electrical characteristics (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) stresses beyond those listed under ?bsolute maximum ratings?may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. v dd to gnd ................................................................-0.3v to +3.6v ov dd to gnd............-0.3v to the lower of (v dd + 0.3v) and +3.6v inap, inan to gnd....-0.3v to the lower of (v dd + 0.3v) and +3.6v inbp, inbn to gnd....-0.3v to the lower of (v dd + 0.3v) and +3.6v clkp, clkn to gnd ........................-0.3v to the lower of (v dd + 0.3v) and +3.6v refin, refout to gnd ..................-0.3v to the lower of (v dd + 0.3v) and +3.6v refap, refan, coma to gnd ......-0.3v to the lower of (v dd + 0.3v) and +3.6v refbp, refbn, comb to gnd ......-0.3v to the lower of (v dd + 0.3v) and +3.6v diffclk/ seclk , g/ t , pd, shref, div2, div4 to gnd .........-0.3v to the lower of (v dd + 0.3v) and +3.6v d0a?11a, d0b?11b, dav, dora, dorb to gnd..............................-0.3v to (ov dd + 0.3v) continuous power dissipation (t a = +70?) 68-pin thin qfn 10mm x 10mm x 0.8mm (derate 70mw/? above +70?) ....................................4000mw thermal resistance jc........................................................0.4?/w operating temperature range................................-40? to +85? junction temperature ...........................................................+150? storage temperature range .................................-65? to +150? lead temperature (soldering, 10s)......................................+300? parameter symbol conditions min typ max units dc accuracy resolution 12 bits integral nonlinearity inl f in = 3mhz ?.65 ?.4 lsb differential nonlinearity dnl f in = 3mhz, no missing codes over temperature ?.4 ?.8 lsb offset error ?.04 0.7 %fsr gain error external reference, v refin = 2.048v ?.4 ?.7 %fsr analog inputs (inap, inan, inbp, inbn) differential input voltage range v diff differential or single-ended inputs ?.024 v common-mode input voltage v dd / 2 v analog input resistance r in each input, figure 3 2.3 k c par fixed capacitance to ground, each input, figure 3 2 analog input capacitance c sample switched capacitance, each input, figure 3 4.5 pf conversion rate maximum clock frequency f clk 96 mhz minimum clock frequency 5 mhz data latency figure 5 8 clock cycles dynamic characteristics (v in = -1dbfs) small-signal noise floor ssnf input at -35dbfs 70.9 72.2 dbfs f in = 3mhz 68.6 70.8 f in = 48mhz 70.6 f in = 70mhz 70.1 signal-to-noise ratio snr f in = 175mhz 67.4 69.7 db
max12529 dual, 96msps, 12-bit, if/baseband adc _______________________________________________________________________________________ 3 electrical characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units f in = 3mhz 67.2 70.5 f in = 48mhz 69.9 f in = 70mhz 69.7 signal-to-noise plus distortion sinad f in = 175mhz 64.9 69.1 db f in = 3mhz 71.9 84.5 f in = 48mhz 81.7 f in = 70mhz 83.2 spurious-free dynamic range sfdr f in = 175mhz 68.8 78.9 dbc f in = 3mhz -82.1 -70 f in = 48mhz -78.7 f in = 70mhz -80.2 total harmonic distortion thd f in = 175mhz -77.9 -66.7 dbc f in = 3mhz -85.7 f in = 48mhz -82.4 f in = 70mhz -86.3 second harmonic hd2 f in = 175mhz -78.9 dbc f in = 3mhz -89.6 f in = 48mhz -86.9 f in = 70mhz -84 third harmonic hd3 f in = 175mhz -88.6 dbc f in1 = 69mhz at a in1 = -7dbfs, f in2 = 72mhz at a in2 = -7dbfs -82 3rd-order intermodulation distortion im3 f in1 = 173mhz at a in1 = -7dbfs, f in2 = 177mhz at a in2 = -7dbfs -87 dbc full-power bandwidth fpbw input at -0.2dbfs, -3db rolloff 750 mhz aperture delay t ad figure 5 1.2 ns aperture jitter t aj < 0.1 ps rms output noise n out inap = inan = coma, inbp = inbn = comb 0.44 lsb rms
max12529 dual, 96msps, 12-bit, if/baseband adc 4 _______________________________________________________________________________________ electrical characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units overdrive recovery time ?0% beyond full scale 1 clock cycle interchannel characteristics f ina or f inb = 70mhz at -1dbfs 92 crosstalk rejection f ina or f inb = 175mhz at -1dbfs 85 db gain matching ?.02 ?.12 db offset matching ?.05 %fsr internal reference (refout) refout output voltage v refout 2.000 2.048 2.080 v refout load regulation -1ma < i refout < +1ma 35 mv/ma refout temperature coefficient tc ref 55 ppm/? short to v dd ?inking 0.24 refout short-circuit current short to gnd?ourcing 2.1 ma buffered reference mode (refin is driven by refout or an external 2.048v single-ended reference source; v refap /v refan /v coma and v refbp /v refbn /v comb are generated internally) refin input voltage v refin 2.048 v refin input resistance r refin > 50 m com_ output voltage v coma v comb v com _ = v dd / 2 1.60 1.65 1.70 v ref_p output voltage v refap v refbp v ref_p = v dd / 2 + (v refin x 3/8) 2.418 v ref_n output voltage v refan v refbn v ref_n = v dd / 2 - (v refin x 3/8) 0.882 v differential reference voltage v refa v refb v refa = v refap - v refan v refb = v refbp - v refbn 1.450 1.536 1.590 v differential reference temperature coefficient tc ref 30 ppm/? unbuffered external reference (refin = gnd, v refap /v refan /v coma and v refbp /v refbn /v comb are applied externally, v coma = v comb = v dd / 2) ref_p input voltage v refap v refbp v ref_p - v com +0.768 v ref_n input voltage v refan v refbn v ref_n - v com -0.768 v com_ input voltage v com v com _ = v dd / 2 1.65 v differential reference voltage v refa v refb v ref_ = v ref_p - v ref_n = v refin x 3/4 1.536 v
max12529 dual, 96msps, 12-bit, if/baseband adc _______________________________________________________________________________________ 5 electrical characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units ref_p sink current i refap i refbp v ref_p = 2.418v 1.2 ma ref_n source current i refan i refbn v ref_n = 0.882v 0.85 ma com_ sink current i coma i comb v com_ = 1.65v 0.85 ma ref_p, ref_n capacitance c ref_p , c ref_n 13 pf com_ capacitance c com_ 6pf clock inputs (clkp, clkn) single-ended input high threshold v ih diffclk/ seclk = gnd, clkn = gnd 0.8 x v dd v single-ended input low threshold v il diffclk/ seclk = gnd, clkn = gnd 0.2 x v dd v minimum differential clock input voltage swing diffclk/ seclk = ov dd 0.2 v p-p differential input common-mode voltage diffclk/ seclk = ov dd v dd / 2 v clk_ input resistance r clk each input, figure 4 5 k clk_ input capacitance c clk each input 2 pf digital inputs (diffclk/ seclk , g/ t , pd, div2, div4) input high threshold v ih 0.8 x ov dd v input low threshold v il 0.2 x ov dd v ov dd applied to input ? input leakage current input connected to ground ? ? digital input capacitance c din 5pf digital outputs (d0a?11a, d0b?11b, dora, dorb, dav) d0a?11a, d0b?11b, dora, dorb: i sink = 200? 0.2 output-voltage low v ol dav: i sink = 600? 0.2 v d0a?11a, d0b?11b, dora, dorb: i source = 200? ov dd - 0.2 output-voltage high v oh dav: i source = 600? ov dd - 0.2 v ov dd applied to input ? tri-state leakage current (note 2) i leak input connected to ground ? ?
max12529 dual, 96msps, 12-bit, if/baseband adc 6 _______________________________________________________________________________________ electrical characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units d 0ad 11a, d o ra, d 0bd 11b and d orb tr i - s tate o utp ut c ap aci tance ( n ote 2) c out 3pf dav tri-state output capacitance (note 2) c dav 6pf power requirements analog supply voltage v dd 3.15 3.30 3.60 v digital output supply voltage ov dd 1.70 2.0 v dd v normal operating mode f in = 175mhz, single-ended clock (diffclk/ seclk = gnd) 288.5 normal operating mode f in = 175mhz, differential clock (diffclk/ seclk = ov dd ) 297 322 analog supply current i vdd power-down mode (pd = ov dd ) clock idle 0.2 ma normal operating mode f in = 175mhz, single-ended clock (diffclk/ seclk = gnd) 952 normal operating mode f in = 175mhz, differential clock (diffclk/ seclk = ov dd ) 980 1063 analog power dissipation p vdd power-down mode (pd = ov dd ) clock idle 0.66 mw normal operating mode f in = 175mhz, c l 10pf 24 digital output supply current i ovdd power-down mode (pd = ov dd ) clock idle 0.001 ma
max12529 dual, 96msps, 12-bit, if/baseband adc _______________________________________________________________________________________ 7 electrical characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference), c l 10pf at digital outputs, a in = -1dbfs (differential), diffclk/ seclk = ov dd , pd = gnd, shref = gnd, div2 = gnd, div4 = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = -40? to +85?, unless otherwise noted. typical values are at t a = +25?.) (note 1) parameter symbol conditions min typ max units timing characteristics (figure 5) clock pulse-width high t ch 5.1 ns clock pulse-width low t cl 5.1 ns data-valid delay t dav (notes 3, 4) 3.15 5.8 6.65 ns data setup time before rising edge of dav t setup (notes 3, 4) 3.6 ns data hold time after rising edge of dav t hold (notes 3, 4) 3.55 ns data setup time before falling edge of clock t d at as e tu p (notes 3, 4) 2.25 ns data hold time after falling edge of clock t datahold (notes 3, 4) 3.25 ns wake-up time from power-down t wake v refin = 2.048v 10 ms note 1: specifications +25? guaranteed by production test, < +25? guaranteed by design and characterization. note 2: during power-down, d0a?11a, d0b?11b, dora, dorb, and dav are high impedance. note 3: data outputs settle to v ih or v il . note 4: guaranteed by design and characterization. typical operating characteristics (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference mode), c l 5pf at digital outputs, a in = -1dbfs (differen- tial), diffclk/ seclk = ov dd , pd = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = +25?, unless otherwise noted.) -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 fft plot (65,536-point data record) max12529 toc01 analog input frequency (mhz) amplitude (dbfs) hd2 hd3 f clk = 96msps f in = 2.99919mhz a in = -1.00dbfs snr = 70.9db sinad = 70.5db thd = -81.1dbc sfdr = 85dbc hd2 = -86.2dbc hd3 = -91.5dbc -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 fft plot (65,536-point data record) max12529 toc02 analog input frequency (mhz) amplitude (dbfs) hd2 hd3 f clk = 96msps f in = 47.89893mhz a in = -0.98dbfs snr = 70.7db sinad = 69.6db thd = -76.1dbc sfdr = 79.8dbc hd2 = -79.7dbc hd3 = -85.2dbc -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 fft plot (65,536-point data record) max12529 toc03 analog input frequency (mhz) amplitude (dbfs) hd2 hd3 f clk = 96msps f in = 70.1001mhz a in = -0.98dbfs snr = 70.2db sinad = 69.8db thd = -80.6dbc sfdr = 84.3dbc hd2 = -93.2dbc hd3 = -85.5dbc
max12529 dual, 96msps, 12-bit, if/baseband adc 8 _______________________________________________________________________________________ -1.00 -0.50 -0.75 0 -0.25 0.25 0.50 0.75 1.00 0 1024 1536 512 2048 2560 3072 3584 4096 integral nonlinearity vs. digital output code max12529 toc07 digital output code inl (lsb) f in = 2.99908mhz -1.00 -0.50 -0.75 0 -0.25 0.25 0.50 0.75 1.00 0 1025 1537 513 2049 2561 3073 3585 4096 differential nonlinearity vs. digital output code max12529 toc08 digital output code dnl (lsb) f in = 2.99908mhz 50 55 65 60 70 75 0 100 50 150 200 250 300 350 snr, sinad vs. analog input frequency (f clk = 96mhz, a in = -1dbfs) max12529 toc09 f in (mhz) snr, sinad (db) snr sinad 50 60 55 70 65 85 80 75 90 0 100 50 150 200 250 300 350 -thd, sfdr vs. analog input frequenc y (f clk = 96mhz, a in = -1dbfs) max12529 toc10 f in (mhz) -thd, sfdr (dbc) sfdr -thd snr, sinad vs. analog input amplitude (f clk = 96mhz, f in = 70mhz) max12529 toc11 a in (dbfs) snr, sinad (db) -5 -10 -20 -15 -50 -45 -40 -35 -30 -25 -55 15 20 25 30 35 40 45 50 55 60 65 70 75 10 -60 0 snr sinad -thd, sfdr vs. analog input amplitude (f clk = 96mhz, f in = 70mhz) max12529 toc12 a in (dbfs) -thd, sfdr (dbc) -5 -10 -20 -15 -50 -45 -40 -35 -30 -25 -55 30 35 40 45 50 55 60 65 70 75 80 85 90 25 -60 0 sfdr -thd -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 fft plot (65,536-point data record) max12529 toc04 analog input frequency (mhz) amplitude (dbfs) hd2 hd3 f clk = 96msps f in = 175.00049mhz a in = -1.00dbfs snr = 69.8db sinad = 69.3db thd = -78.3dbc sfdr = 80.3dbc hd2 = -80.2dbc hd3 = -89.3dbc -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 two-tone imd (65,536-point data record) max12529 toc05 analog input frequency (mhz) amplitude (dbfs) f clk = 96msps f in1 = 68.50049mhz a in1 = -7dbfs f in2 = 71.50049mhz a in2 = -7.04dbfs im3 = -84.5dbc f in1 2f in1 - f in2 2f in2 - f in1 f in2 -120 -60 -80 -100 -40 -20 0 020 15 5 10 2530354045 two-tone imd plot (65,536-point data record) max12529 toc06 analog input frequency (mhz) amplitude (dbfs) f clk = 96msps f in1 = 172.50146mhz a in1 = -6.97dbfs f in2 = 177.50244mhz a in2 = -7.01dbfs im3 = -84.7dbc f in2 f in1 2f in1 - f in2 2f in2 - f in1 typical operating characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference mode), c l 5pf at digital outputs, a in = -1dbfs (differen- tial), diffclk/ seclk = ov dd , pd = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = +25?, unless otherwise noted.)
max12529 dual, 96msps, 12-bit, if/baseband adc _______________________________________________________________________________________ 9 snr, sinad vs. analog input amplitude (f clk = 96mhz, f in = 175mhz) max12529 toc13 a in (dbfs) snr, sinad (db) -5 -10 -20 -15 -50 -45 -40 -35 -30 -25 -55 15 20 25 30 35 40 45 50 55 60 65 70 75 10 -60 0 snr sinad -thd, sfdr vs. analog input amplitude (f clk = 96mhz, f in = 175mhz) max12529 toc14 a in (dbfs) -thd, sfdr (dbc) -5 -10 -20 -15 -50 -45 -40 -35 -30 -25 -55 30 35 40 45 50 55 60 65 70 75 80 85 90 25 -60 0 sfdr -thd snr, sinad vs. clock speed (f in = 70mhz, a in = -1dbfs) max12529 toc15 f clk (mhz) snr, sinad (db) 90 80 70 60 50 40 30 55 60 65 70 75 50 20 100 snr sinad div4 = 0v dd div2 = gnd -thd, sfdr vs. clock speed (f in = 70mhz, a in = -1dbfs) max12529 toc16 f clk (mhz) -thd, sfdr (dbc) 90 80 30 40 50 60 70 65 70 75 80 85 90 95 100 60 20 100 -thd sfdr div4 = 0v dd div2 = gnd snr, sinad vs. clock speed (f in = 175mhz, a in = -1dbfs) max12529 toc17 f clk (mhz) snr, sinad (db) 90 80 70 60 50 40 30 55 60 65 70 75 50 20 100 div4 = 0v dd div2 = gnd sinad snr -thd, sfdr vs. clock speed (f in = 175mhz, a in = -1dbfs) max12529 toc18 f clk (mhz) -thd, sfdr (dbc) 90 80 30 40 50 60 70 55 60 65 70 75 80 85 90 50 20 100 -thd sfdr div4 = 0v dd div2 = gnd snr, sinad vs. analog supply voltage (f clk = 96mhz, f in = 70mhz) max12529 toc19 v dd (v) snr, sinad (db) 3.5 3.4 3.3 3.2 66 68 70 72 74 64 3.1 3.6 sinad snr -thd, sfdr vs. analog supply voltage (f clk = 96mhz, f in = 70mhz) max12529 toc20 v dd (v) -thd, sfdr (dbc) 3.5 3.4 3.3 3.2 50 60 70 80 90 100 40 3.1 3.6 sfdr -thd snr, sinad vs. analog supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc21 v dd (v) snr, sinad (db) 3.5 3.4 3.3 3.2 62 64 66 68 70 72 60 3.1 3.6 snr sinad typical operating characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference mode), c l 5pf at digital outputs, a in = -1dbfs (differen- tial), diffclk/ seclk = ov dd , pd = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = +25?, unless otherwise noted.)
max12529 dual, 96msps, 12-bit, if/baseband adc 10 ______________________________________________________________________________________ -thd, sfdr vs. analog supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc22 v dd (v) -thd, sfdr (dbc) 3.5 3.4 3.3 3.2 60 65 70 75 80 85 55 3.1 3.6 -thd sfdr snr, sinad vs. digital supply voltage (f clk = 96mhz, f in = 70mhz) max12529 toc23 ov dd (v) snr, sinad (db) 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 66 68 70 72 74 64 1.6 3.6 snr sinad -thd, sfdr vs. digital supply voltage (f clk = 96mhz, f in = 70mhz) max12529 toc24 ov dd (v) -thd, sfdr (dbc) 3.4 3.2 1.8 2.0 2.2 2.6 2.8 2.4 3.0 55 60 65 70 75 80 85 90 50 1.6 3.6 sfdr -thd snr, sinad vs. digital supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc25 ov dd (v) snr, sinad (db) 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 55 60 65 70 75 50 1.6 3.6 snr sinad -thd, sfdr vs. digital supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc26 ov dd (v) -thd, sfdr (dbc) 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 60 65 70 75 80 85 90 55 1.6 3.6 sfdr -thd 100 500 300 900 700 1100 1300 3.1 3.6 p diss , i vdd (analog) vs. analog supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc27 v dd (v) p diss , i vdd (mw, ma) 3.3 3.2 3.4 3.5 p diss (analog) i vdd 0 20 10 40 30 50 60 80 70 90 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 p diss , i ovdd (digital) vs. digital supply voltage (f clk = 96mhz, f in = 175mhz) max12529 toc28 ov dd (v) p diss , i ovdd (mw, ma) p diss (digital) i ovdd snr, sinad vs. clock duty cycle (f in = 70mhz, a in = -1dbfs) max12529 toc29 clock duty cycle (%) snr, sinad (db) 55 60 65 70 75 50 25 70 30 35 40 45 50 55 60 65 single-ended clock drive snr sinad -thd, sfdr vs. clock duty cycle (f in = 70mhz, a in = -1dbfs) max12529 toc30 clock duty cycle (%) -thd, sfdr (dbc) 70 65 75 80 85 90 60 25 70 30 35 40 45 50 55 60 65 single-ended clock drive sfdr -thd typical operating characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference mode), c l 5pf at digital outputs, a in = -1dbfs (differen- tial), diffclk/ seclk = ov dd , pd = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = +25?, unless otherwise noted.)
max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 11 snr, sinad vs. temperature (f in = 175mhz, a in = -1dbfs) max12529 toc31 temperature ( c) snr, sinad (db) 60 35 10 -15 62 64 66 68 70 72 60 -40 85 snr sinad -thd, sfdr vs. temperature (f in = 175mhz, a in = -1dbfs) max12529 toc32 temperature ( c) -thd, sfdr (dbc) 60 35 10 -15 65 70 75 80 85 90 60 -40 85 sfdr -thd gain error vs. temperature (v refin = 2.048v) max12529 toc33 temperature ( c) gain error (%fsr) 60 35 10 -15 -2 -1 0 1 2 3 -3 -40 85 offset error vs. temperature max12529 toc34 temperature ( c) offset error (%fsr) 60 35 10 -15 -0.2 -0.1 0 0.1 0.2 0.3 -0.3 -40 85 typical operating characteristics (continued) (v dd = 3.3v, ov dd = 2.0v, gnd = 0, refin = refout (internal reference mode), c l 5pf at digital outputs, a in = -1dbfs (differen- tial), diffclk/ seclk = ov dd , pd = gnd, g/ t = gnd, f clk = 96mhz (50% duty cycle), t a = +25?, unless otherwise noted.)
max12529 dual, 96msps, 12-bit, if/baseband adc 12 ______________________________________________________________________________________ pin name function 1, 4, 5, 9, 13, 14, 17 gnd converter ground. connect all ground pins and the exposed paddle (ep) together. 2 inap channel a positive analog input 3 inan channel a negative analog input 6 coma channel a common-mode voltage i/o. bypass coma to gnd with a 0.1? capacitor. 7 refap channel a positive reference i/o. channel a conversion range is ?/3 x (v refap - v refan ). bypass refap with a 0.1? capacitor to gnd. connect a 10? and a 1? bypass capacitor between refap and refan. place the 1? refap-to-refan capacitor as close to the device as possible on the same side of the pc board. 8 refan channel a negative reference i/o. channel a conversion range is ?/3 x (v refap - v refan ). bypass refan with a 0.1? capacitor to gnd. connect a 10? and a 1? bypass capacitor between refap and refan. place the 1? refap-to-refan capacitor as close to the device as possible on the same side of the pc board. 10 refbn channel b negative reference i/o. channel b conversion range is ?/3 x (v refbp - v refbn ). bypass refbn with a 0.1? capacitor to gnd. connect a 10? and a 1? bypass capacitor between refbp and refbn. place the 1? refbp-to-refbn capacitor as close to the device as possible on the same side of the pc board. 11 refbp channel b positive reference i/o. channel b conversion range is ?/3 x (v refbp - v refbn ). bypass refbp with a 0.1? capacitor to gnd. connect a 10? and a 1? bypass capacitor between refbp and refbn. place the 1? refbp-to-refbn capacitor as close to the device as possible on the same side of the pc board. 12 comb channel b common-mode voltage i/o. bypass comb to gnd with a 0.1? capacitor. 15 inbn channel b negative analog input 16 inbp channel b positive analog input 18 diffclk/ seclk differential/single-ended input clock drive. this input selects between single-ended or differential clock input drives. diffclk/ seclk = gnd: selects single-ended clock input drive. diffclk/ seclk = ov dd : selects differential clock input drive. 19 clkn negative clock input. in differential clock input mode (diffclk/ seclk = ov dd ), connect a differential clock signal between clkp and clkn. in single-ended clock mode (diffclk/ seclk = gnd), apply the clock signal to clkp and connect clkn to gnd. 20 clkp positive clock input. in differential clock input mode (diffclk/ seclk = ov dd ), connect a differential clock signal between clkp and clkn. in single-ended clock mode (diffclk/ seclk = gnd), apply the single-ended clock signal to clkp and connect clkn to gnd. 21 div2 divide-by-two clock-divider digital control input. see table 2 for details. 22 div4 divide-by-four clock-divider digital control input. see table 2 for details. 23?6, 61, 62, 63 v dd analog power input. connect v dd to a 3.15v to 3.60v power supply. bypass v dd to gnd with a parallel capacitor combination of 10? and 0.1?. connect all v dd pins to the same potential. 27, 43, 60 ov dd output-driver power input. connect ov dd to a 1.7v to v dd power supply. bypass ov dd to gnd with a parallel capacitor combination of 10? and 0.1?. 28, 29, 45, 46 n.c. no connection pin description
max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 13 pin name function 30 d0b channel b cmos digital output, bit 0 (lsb) 31 d1b channel b cmos digital output, bit 1 32 d2b channel b cmos digital output, bit 2 33 d3b channel b cmos digital output, bit 3 34 d4b channel b cmos digital output, bit 4 35 d5b channel b cmos digital output, bit 5 36 d6b channel b cmos digital output, bit 6 37 d7b channel b cmos digital output, bit 7 38 d8b channel b cmos digital output, bit 8 39 d9b channel b cmos digital output, bit 9 40 d10b channel b cmos digital output, bit 10 41 d11b channel b cmos digital output, bit 11 (msb) 42 dorb channel b data out-of-range indicator. the dorb digital output indicates when the channel b analog input voltage is out of range. dorb = 1: digital outputs exceed full-scale range. dorb = 0: digital outputs are within full-scale range. 44 dav data-valid digital output. the rising edge of dav indicates that data is present on the digital outputs. the max12529 evaluation kit utilizes dav to latch data into any external back-end digital logic. 47 d0a channel a cmos digital output, bit 0 (lsb) 48 d1a channel a cmos digital output, bit 1 49 d2a channel a cmos digital output, bit 2 50 d3a channel a cmos digital output, bit 3 51 d4a channel a cmos digital output, bit 4 52 d5a channel a cmos digital output, bit 5 53 d6a channel a cmos digital output, bit 6 54 d7a channel a cmos digital output, bit 7 55 d8a channel a cmos digital output, bit 8 56 d9a channel a cmos digital output, bit 9 57 d10a channel a cmos digital output, bit 10 58 d11a channel a cmos digital output, bit 11 (msb) 59 dora channel a data out-of-range indicator. the dora digital output indicates when the channel a analog input voltage is out of range. dora = 1: digital outputs exceed full-scale range. dora = 0: digital outputs are within full-scale range. 64 g/ t output format select digital input. g/ t = gnd: two?-complement output format selected. g/ t = ov dd : gray-code output format selected. 65 pd power-down digital input. pd = gnd: adcs are fully operational. pd = ov dd : adcs are powered down. pin description (continued)
max12529 detailed description the max12529 uses a 10-stage, fully differential, pipelined architecture (figure 1) that allows for high- speed conversion while minimizing power consump- tion. samples taken at the inputs move progressively through the pipeline stages every half clock cycle. from input to output the total latency is 8 clock cycles. each pipeline converter stage converts its input voltage to a digital output code. at every stage, except the last, the error between the input voltage and the digital out- put code is multiplied and passed along to the next pipeline stage. digital error correction compensates for adc comparator offsets in each pipeline stage and ensures no missing codes. figure 2 shows the max12529 functional diagram. dual, 96msps, 12-bit, if/baseband adc 14 ______________________________________________________________________________________ pin name function 66 shref shared reference digital input. shref = v dd : shared reference enabled. shref = gnd: shared reference disabled. when sharing the reference, externally connect refap and refbp together to ensure that v refap equals v refbp . similarly, when sharing the reference, externally connect refan to refbn together to ensure that v refan = v refbn . 67 refout internal reference voltage output. the refout output voltage is 2.048v and refout can deliver 1ma. for internal reference operation, connect refout directly to refin or use a resistive divider from refout to set the voltage at refin. bypass refout to gnd with a 0.1? capacitor. for external reference operation, refout is not required and must be bypassed to gnd with a 0.1? capacitor. 68 refin single-ended reference analog input. for internal reference and buffered external reference operation, apply a 0.7v to 2.3v dc reference voltage to refin. bypass refin to gnd with a 4.7? capacitor. within its specified operating voltage, refin has a > 50m input impedance, and the differential reference voltage (v ref_p - v ref_n ) is generated from refin. for unbuffered external reference operation, connect refin to gnd. in this mode ref_p, ref_n, and com_ are high-impedance inputs that accept the external reference voltages. ?p exposed paddle. ep is internally connected to gnd. externally connect ep to gnd to achieve specified dynamic performance. pin description (continued) max12529 + ? digital error correction flash adc x2 dac stage 2 in_p in_n stage 1 stage 9 stage 10 end of pipeline d0_ through d11_ figure 1. pipeline architecture?tage blocks
max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 15 inbp 12-bit pipeline adc digital error correction channel a reference system coma refan refap ov dd dav output drivers dora clock divider data format 12-bit pipeline adc digital error correction output drivers data format div2 div4 inbn d0b to d11b dorb channel b reference system comb refbn refbp inap inan clkp clkn duty-cycle equalizer clock clock power control and bias circuits pd v dd gnd clock refin internal reference generator refout shref diffclk/seclk d0a to d11a g/t max12529 figure 2. functional diagram
max12529 analog inputs and input track-and-hold (t/h) amplifier figure 3 displays a simplified functional diagram of the input t/h circuit. this input t/h circuit allows for high analog input frequencies of 175mhz and beyond and supports a v dd / 2 common-mode input voltage. the max12529 sampling clock controls the switched- capacitor input t/h architecture (figure 3) allowing the analog input signals to be stored as charge on the sampling capacitors. these switches are closed (track mode) when the sampling clock is high and open (hold mode) when the sampling clock is low (figure 4). the analog input signal source must be able to provide the dynamic currents necessary to charge and discharge the sampling capacitors. to avoid signal degradation, these capacitors must be charged to one-half lsb accuracy within one-half of a clock cycle. the analog input of the max12529 supports differential or single- ended input drive. for optimum performance with differ- ential inputs, balance the input impedance of in_p and in_n and set the common-mode voltage to mid-supply (v dd / 2). the max12529 provides the optimum com- mon-mode voltage of v dd / 2 through the com output when operating in internal reference mode and buffered external reference mode. this com output voltage can be used to bias the input network as shown in figures 9, 10, and 11. reference output an internal bandgap reference is the basis for all the internal voltages and bias currents used in the max12529. the power-down logic input (pd) enables and disables the reference circuit. refout has approxi- mately 17k to gnd when the max12529 is powered down. the reference circuit requires 10ms to power up and settle to its final value when power is applied to the max12529 or when pd transitions from high to low. the internal bandgap reference produces a buffered reference voltage of 2.048v 1% at the refout pin with a 50ppm/? temperature coefficient. connect an external 0.1? bypass capacitor from refout to gnd for stability. refout sources up to 1ma and sinks up to 0.1ma for external circuits with a 35mv/ma load regulation. short-circuit protection limits i refout to a 2.1ma source current when shorted to gnd and a 0.24ma sink current when shorted to v dd . similar to refout, refin should be bypassed with a 4.7? capacitor to gnd. reference configurations the max12529 full-scale analog input range is ?/3 x v ref with a v dd / 2 ?.5v common-mode input range. v ref is the voltage difference between refap (refbp) and refan (refbn). the max12529 provides three modes of reference operation. the voltage at refin (v refin ) selects the reference operation mode (table 1). connect refout to refin either with a direct short or through a resistive divider to enter internal reference mode. com_, ref_p, and ref_n are low-impedance outputs with v com_ = v dd / 2, v ref_p = v dd / 2 + 3/8 x v refin , and v ref_n = v dd / 2 - 3/8 x v refin . bypass ref_p, ref_n, and com_ each with a 0.1? capacitor to gnd. bypass ref_p to ref_n with a 10? capacitor. dual, 96msps, 12-bit, if/baseband adc 16 ______________________________________________________________________________________ v refin reference mode 35% v refout to 100% v refout internal reference mode. refin is driven by refout either through a direct short or a resistive divider. v com_ = v dd / 2 v ref_p = v dd / 2 + 3/8 x v refin v ref_n = v dd / 2 - 3/8 x v refin 0.7v to 2.3v buffered external reference mode. an external 0.7v to 2.3v reference voltage is applied to refin. v com_ = v dd / 2 v ref_p = v dd / 2 + 3/8 x v refin v ref_n = v dd / 2 - 3/8 x v refin < 0.5v u nb uffer ed e xter nal refer ence m od e. re f_p , re f_n , and c o m _ ar e d r i ven b y exter nal r efer ence sour ces. the ful l - scal e anal og i np ut r ang e i s ( v r e f _p - v r e f _n ) x 2/3. table 1. reference modes max12529 c par 2pf v dd bond wire inductance 1.5nh in_p sampling clock *the effective resistance of the switched sampling capacitors is: *c sample 4.5pf c par 2pf v dd bond wire inductance 1.5nh in_n *c sample 4.5pf r in = 1 f clk x c sample figure 3. internal t/h circuit
bypass refin and refout to gnd with a 0.1? capac- itor. the refin input impedance is very large (> 50m ). when driving refin through a resistive divider, use resistances 10k to avoid loading refout. buffered external reference mode is virtually identical to the internal reference mode except that the reference source is derived from an external reference and not the max12529? internal bandgap reference. in buffered external reference mode, apply a stable reference volt- age source between 0.7v to 2.3v at refin. pins com_, ref_p, and ref_n are low-impedance outputs with v com_ = v dd / 2, v ref_p = v dd / 2 + 3/8 x v refin , and v ref_n = v dd / 2 - 3/8 x v refin . bypass ref_p, ref_n, and com_ each with a 0.1? capacitor to gnd. bypass ref_p to ref_n with a 10? capacitor. connect refin to gnd to enter unbuffered external ref- erence mode. connecting refin to gnd deactivates the on-chip reference buffers for com_, ref_p, and ref_n. with their buffers deactivated, com_, ref_p, and ref_n become high-impedance inputs and must be driven with separate, external reference sources. drive v com_ to v dd / 2 ?%, and drive ref_p and ref_n so v com_ = (v ref_p_ + v ref_n_ ) / 2. the analog input range is ?v ref_p_ - v ref_n ) x 2/3. bypass ref_p, ref_n, and com_ each with a 0.1? capacitor to gnd. bypass ref_p to ref_n with a 10? capacitor. for all reference modes, bypass refout with a 0.1? and refin with a 4.7? capacitor to gnd. the max12529 also features a shared reference mode, in which the user can achieve better channel-to-chan- nel matching. when sharing the reference (shref = v dd ), externally connect refap and refbp together to ensure that v refap = v refbp . similarly, when sharing the reference, externally connect refan to refbn together to ensure that v refan = v refbn . connect shref to gnd to disable the shared refer- ence mode of the max12529. in this independent refer- ence mode, a better channel-to-channel isolation is achieved. for detailed circuit suggestions and how to drive the adc in buffered/unbuffered external reference mode, see the applications information section. clock duty-cycle equalizer the max12529 has an internal clock duty-cycle equaliz- er, which makes the converter insensitive to the duty cycle of the signal applied to clkp and clkn. the con- verters allow clock duty-cycle variations from 25% to 75% without negatively impacting the dynamic performance. the clock duty-cycle equalizer uses a delay-locked loop (dll) to create internal timing signals that are duty-cycle independent. due to this dll, the max12529 requires approximately 100 clock cycles to acquire and lock to new clock frequencies. clock input and clock control lines the max12529 accepts both differential and single- ended clock inputs with a wide 25% to 75% input clock duty cycle. for single-ended clock input operation, connect diffclk/ seclk and clkn to gnd. apply an external single-ended clock signal to clkp. to reduce clock jitter, the external single-ended clock must have sharp falling edges. for differential clock input opera- tion, connect diffclk/ seclk to ov dd . apply an external differential clock signal to clkp and clkn. consider the clock input as an analog input and route it away from any other analog inputs and digital signal lines. clkp and clkn enter high impedance when the max12529 is powered down (figure 4). low clock jitter is required for the specified snr perfor- mance of the max12529. the analog inputs are sam- pled on the falling (rising) edge of clkp (clkn), requiring this edge to have the lowest possible jitter. jitter limits the maximum snr performance of any adc according to the following relationship: where f in represents the analog input frequency and t j is the total system clock jitter. clock jitter is especially critical for undersampling applications. for instance, assuming that clock jitter is the only noise source, to obtain the specified 69.5db of snr with an input fre- quency of 175mhz, the system must have less than 0.31ps of clock jitter. however, in reality there are other noise sources such as thermal noise and quantization noise that contribute to the system noise requiring the clock jitter to be less than 0.2ps to obtain the specified 69.5db of snr at 175mhz. clock-divider control inputs (div2, div4) the max12529 features three different modes of sam- pling/clock operation (see table 2). pulling both control lines low, the clock-divider function is disabled and the converters sample at full clock speed. pulling div4 low and div2 high enables the divide-by-two feature, which sets the sampling speed to one-half the selected clock frequency. in divide-by-four mode, the converter sam- pling speed is set to one-fourth the clock speed of the max12529. divide-by-four mode is achieved by applying a high level to div4 and a low level to div2. the option to select either one-half or one-fourth of the clock speed for snr ft in j log = ? ? ? ? ? ? 20 1 2 max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 17
max12529 sampling provides design flexibility, relaxes clock requirements, and can minimize clock jitter. system timing requirements figure 5 shows the timing relationship between the clock, analog inputs, dav indicator, dor_ indicators, and the resulting output data. the analog input is sam- pled on the falling (rising) edge of clkp (clkn) and the resulting data appears at the digital outputs 8 clock cycles later. the dav indicator is synchronized with the digital out- put and optimized for use in latching data into digital back-end circuitry. alternatively, digital back-end cir- cuitry can be latched with the rising edge of the con- version clock (clkp - clkn). data-valid output dav is a single-ended version of the input clock that is compensated to correct for any input clock duty-cycle variations. the max12529 output data changes on the falling edge of dav, and dav rises once the output data is valid. the falling edge of dav is synchronized to have a 5.8ns delay from the falling edge of the input clock. output data at d0a/b?11a/b and dora/b are valid from 3.6ns before the rising edge of dav to 3.55ns after the rising edge of dav. dav enters high impedance when the max12529 is powered down (pd = ov dd ). dav enters its high- impedance state 10ns after the rising edge of pd and becomes active again 10ns after pd transitions low. dav can sink and source 600? and has three times the driving capabilities of d0a/b?11a/b and dora/b. dav is typically used to latch the max12529 output data into an external digital back-end circuit. keep the capacitive load on dav as low as possible (< 15pf) to avoid large digital currents feeding back into the analog portion of the max12529, thereby degrading its dynamic perfor- mance. buffering dav externally isolates it from heavy dual, 96msps, 12-bit, if/baseband adc 18 ______________________________________________________________________________________ max12529 clkp clkn v dd gnd 10k 10k 10k 10k duty-cycle equalizer s 1h s 2h s 2l s 1l switches s 1_ and s 2_ are open during power-down making clkp and clkn high impedance. switches s 2_ are open in single-ended clock mode. figure 4. simplified clock input circuit div4 div2 function 00 clock divider disabled f sample = f clk 01 divide-by-two clock divider f sample = f clk / 2 10 divide-by-four clock divider f sample = f clk / 4 1 1 not allowed table 2. clock-divider control inputs dav n n + 1 n +2 n + 3 n + 4 n + 5 n + 6 n + 7 n + 8 n + 9 t dav t setup t ad n - 1 n - 2 n - 3 t hold t cl t ch differential analog input (in_p?n_n) clkn clkp (v ref_p - v ref_n ) x 2/3 (v ref_n - v ref_p ) x 2/3 d0_?13_ dor 8.0 clock-cycle data latency t datasetup t datahold n - 2 n n + 1 n + 3 n + 4 n + 5 n + 6 n + 7 n + 8 n + 9 n - 3 n - 1 n + 2 figure 5. system timing diagram
capacitive loads. refer to the max12529 ev kit schemat- ic for recommendations of how to drive the dav signal through an external buffer. data out-of-range indicator the dora and dorb digital outputs indicate when the analog input voltage is out of range. when dor_ is high, the analog input is out of range. when dor_ is low, the analog input is within range. the valid differential input range is from (v ref_p - v ref_n ) x 2/3 to (v ref_n - v ref_p ) x 2/3. signals outside of this valid differential range cause dor_ to assert high as shown in table 1. dor is synchronized with dav and transitions along with the output data d11_?0_. there is an 8 clock- cycle latency in the dor function as is with the output data (figure 5). dor_ is high impedance when the max12529 is in power-down (pd = high). dor_ enters a high-impedance state within 10ns after the rising edge of pd and becomes active 10ns after pd? falling edge. digital output data and output format selection the max12529 provides two 12-bit, parallel, tri-state output buses. d0a/b?11a/b and dora/b update on the falling edge of dav and are valid on the rising edge of dav. the max12529 output data format is either gray code or two? complement depending on the logic input g/ t . with g/ t high, the output data format is gray code. with g/ t low, the output data format is set to two? com- plement. see figure 8 for a binary-to-gray and gray-to- binary code conversion example. the following equations, table 3, figure 6, and figure 7 define the relationship between the digital output and the analog input. gray code (g/ t = 1): v in_p - v in_n = 2/3 x (v ref_p - v ref_n ) x 2 x (code 10 - 2048) / 4096 two? complement (g/ t = 0): v in_p - v in_n = 2/3 x (v ref_p - v ref_n ) x 2 x code 10 / 4096 where code 10 is the decimal equivalent of the digital output code as shown in table 3. max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 19 gray-code output code (g/ t = 1) two?-complement output code (g/ t = 0) binary d11a?0a d11b?0b dor h exa d ecim a l equivalent of d11a?0a d11b?0b decimal equivalent of d11a?0a d11b?0b (code 10 ) binary d11a?0a d11b?0b dor hexadecimal equivalent of d11a?0a d11b?0b decimal equivalent of d11a?0a d11b?0b (code 10 ) v in_p - v in_n v ref _ p = 2.418v v ref _ n = 0.882v 1000 0000 0000 1 0x800 +4095 0111 1111 1111 1 0x7ff +2047 > +1.0235v (data out of range) 1000 0000 0000 0 0x800 +4095 0111 1111 1111 0 0x7ff +2047 +1.0235v 1000 0000 0001 0 0x801 +4094 0111 1111 1110 0 0x7fe +2046 +1.0230v 1100 0000 0011 0 0xc03 +2050 0000 0000 0010 0 0x002 +2 +0.0010v 1100 0000 0001 0 0xc01 +2049 0000 0000 0001 0 0x001 +1 +0.0005v 1100 0000 0000 0 0xc00 +2048 0000 0000 0000 0 0x000 0 +0.0000v 0100 0000 0000 0 0x400 +2047 1111 1111 1111 0 0xfff -1 -0.0005v 0100 0000 0001 0 0x401 +2046 1111 1111 1110 0 0xffe -2 -0.0010v 0000 0000 0001 0 0x001 +1 1000 0000 0001 0 0x801 -2047 -1.0235v 0000 0000 0000 0 0x000 0 1000 0000 0000 0 0x800 -2048 -1.0240v 0000 0000 0000 1 0x000 0 1000 0000 0000 1 0x800 -2048 < -1.0240v (data out of range) table 3. output codes vs. input voltage
max12529 the digital outputs d0a/b?11a/b are high impedance when the max12529 is in power-down (pd = 1) mode. d0a/b?11a/b enter this state 10ns after the rising edge of pd and become active again 10ns after pd transitions low. keep the capacitive load on the max12529 digital out- puts d0a/b?11a/b as low as possible (< 15pf) to avoid large digital currents feeding back into the ana- log portion of the max12529 and degrading its dynam- ic performance. adding external digital buffers on the digital outputs helps isolate the max12529 from heavy capacitive loads. to improve the dynamic performance of the max12529, add 220 resistors in series with the digital outputs close to the max12529. refer to the max12529 ev kit schematic for guidelines of how to drive the digital outputs through 220 series resistors and external digital output buffers. power-down input the max12529 has two power modes that are con- trolled with a power-down digital input (pd). with pd low, the max12529 is in its normal operating mode. with pd high, the max12529 is in power-down mode. the power-down mode allows the max12529 to effi- ciently use power by transitioning to a low-power state when conversions are not required. additionally, the max12529 parallel output bus goes high-impedance in power-down mode, allowing other devices on the bus to be accessed. in power-down mode all internal circuits are off, the analog supply current reduces to less than 100?, and the digital supply current reduces to less than 1?. the following list shows the state of the analog inputs and digital outputs in power-down mode: 1) inap/b and inan/b analog inputs are disconnect- ed from the internal input amplifier (figure 3). 2) refout has approximately 17k to gnd. 3) refap/b, coma/b, and refan/b enter a high- impedance state with respect to v dd and gnd, but there is an internal 4k resistor between refap/b and coma/b, as well as an internal 4k resistor between refan/b and coma/b. 4) d0a?11a, d0b?11b, dora, and dorb enter a high-impedance state. 5) dav enters a high-impedance state. 6) clkp and clkn clock inputs enter a high-imped- ance state (figure 4). the wake-up time from power-down mode is dominated by the time required to charge the capacitors at ref_p, ref_n, and com. in internal reference mode and buffered external reference mode the wake-up time is typically 10ms. when operating in the unbuffered exter- nal reference mode the wake-up time is dependent on the external reference drivers. dual, 96msps, 12-bit, if/baseband adc 20 ______________________________________________________________________________________ differential input voltage (lsb) two's-complement output code (lsb) -2045 +2047 +2045 -1 0 +1 -2047 0x800 0x801 0x802 0x803 0x7ff 0x7fe 0x7fd 0xfff 0x000 0x001 2/3 x (v refp - v refn ) 2/3 x (v refp - v refn ) 1 lsb = 4/3 x (v refp - v refn ) / 4096 figure 6. two?-complement transfer function (g/ t = 0) differential input voltage (lsb) gray output code (lsb) -2045 +2047 +2045 -1 0 +1 -2047 0x000 0x001 0x003 0x002 0x800 0x801 0x803 0xc00 0xc00 0xc01 2/3 x (v refp - v refn ) 2/3 x (v refp - v refn ) 1 lsb = 4/3 x (v refp - v refn ) / 4096 figure 7. gray-code transfer function (g/ t = 1)
max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 21 binary-to-gray code conversion 1) the most significant gray-code bit is the same as the most significant binary bit. 0111 0100 1100 binary gray code 0 2) subsequent gray-code bits are found according to the following equation: d11 d7 d3 d0 gray x = binary x + binary x + 1 bit position 0 111 0100 1100 binary gray code 0 d11 d7 d3 d0 bit position gray 10 = binary 10 binary 11 gray 10 = 1 0 gray 10 = 1 1 3) repeat step 2 until complete: 01 11 0100 1100 binary gray code 0 d11 d7 d3 d0 bit position gray 9 = binary 9 binary 10 gray 9 = 1 1 gray 9 = 0 10 4) the final gray-code conversion is: 0111 0100 1100 binary gray code 0 d11 d7 d3 d0 bit position 100110 1 1010 gray-to-binary code conversion 1) the most significant binary bit is the same as the most significant gray-code bit. 2) subsequent binary bits are found according to the following equation: d11 d7 d3 d0 binary x = binary x+1 bit position binary 10 = binary 11 gray 10 binary 10 = 0 1 binary 10 = 1 3) repeat step 2 until complete: 4) the final binary conversion is: 0100 1110 1010 binary gray code d11 d7 d3 d0 bit position 0 binary gray code 0100 11 0 11010 binary 9 = binary 10 gray 9 binary 9 = 1 0 binary 9 = 1 gray x 0 100 1110 1010 binary gray code 0 d11 d7 d3 d0 bit position 1 01 00 1110 1010 binary gray code 0 d11 d7 d3 d0 bit position 11 0111 0100 1100 ab y=ab 00 01 10 11 0 1 1 0 exclusive or truth table where is the exclusive or function (see truth table below) and x is the bit position: + where is the exclusive or function (see truth table below) and x is the bit position: + + + + + + + + + + + + + + + figure 8 shows the gray-to-binary and binary-to-gray code conversion in offset binary format. the output format of the max12529 is two's-complement binary, hence each msb of the two's-complement output code must be inverted to reflect true offset binary format. figure 8. binary-to-gray and gray-to-binary code conversion
max12529 applications information using transformer coupling in general, the max12529 provides better sfdr and thd with fully differential input signals than single- ended input drive, especially for input frequencies above 125mhz. in differential input mode, even-order harmonics are lower as both inputs are balanced, and each of the adc inputs only requires half the signal swing compared to single-ended input mode. an rf transformer (figure 9) provides an excellent solution to convert a single-ended input source signal to a fully differential signal, required by the max12529 for optimum performance. connecting the center tap of the transformer to com provides a v dd / 2 dc level shift to the input. although a 1:1 transformer is shown, a step-up transformer can be selected to reduce the drive requirements. a reduced signal swing from the input driver, such as an op amp, can also improve the overall distortion. the configuration of figure 9 is good for frequencies up to nyquist (f clk / 2). the circuit of figure 10 converts a single-ended input signal to fully differential just as figure 9. however, figure 10 utilizes an additional transformer to improve the common-mode rejection allowing high-frequency signals beyond the nyquist frequency. a set of 75 dual, 96msps, 12-bit, if/baseband adc 22 ______________________________________________________________________________________ max12529 1 5 3 6 2 4 n.c. n.c. v in 0.1 f t1 mini-circuits adt1-1wt 24.9 24.9 49.9 0.5% 49.9 0.5% 5.6pf 5.6pf 0.1 f in_p com_ in_n figure 9. transformer-coupled input drive for input frequencies up to nyquist 1 5 3 6 2 4 n.c. v in 0.1 f t1 mini-circuits adt1-1wt in_p com_ in_n *0 resistors can be replaced with low-value resistors to limit the input bandwidth. n.c. 1 5 3 6 2 4 n.c. t2 mini-circuits adt1-1wt n.c. 75 0.5% 75 0.5% 110 0.5% 110 0.5% 0.1 f 0 * 0 * max12529 c in r in c in r in figure 10. transformer-coupled input drive for input frequencies beyond nyquist max12529 max4108 0.1 f 0.1 f 0 5.6pf in_p com_ in_n 100 100 v in 24.9 24.9 5.6pf figure 11. single-ended, ac-coupled input drive
and 110 termination resistors provide an equivalent 50 termination to the signal source. the second set of termination resistors connects to com_ providing the correct input common-mode voltage. two 0 resistors in series with the analog inputs allow high if input fre- quencies. these 0 resistors can be replaced with low- value resistors to limit the input bandwidth. the input network in figure 10 can be modified to enhance the frequency-range specific ac performance of the max12529 by simply replacing the input capaci- tance with a series network of resistor (r in ) and capacitor (c in ). table 4 displays a selection of resistors and capac- itors that are recommended to help improve the already excellent performance of this adc for specific applica- tions requiring only a certain range of input frequencies. single-ended ac-coupled input signal figure 11 shows an ac-coupled, single-ended input application. the max4108 provides high speed, high bandwidth, low noise, and low distortion to maintain the input signal integrity. max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________________________ 23 max4230 0.1 f 1 f 5 2 3 4 1 1 5 2 refin v dd gnd 0.1 f 47 3.3v 2.048v 16.2k refout 0.1 f ref_p ref_n com_ 0.1 f 0.1 f 0.1 f 2.2 f 0.1 f 3.3v 1.47k 300 f 6v note: one front-end reference circuit is capable of sourcing up to 15ma and sinking up to 30ma of output current. 10 f 0.1 f refin v dd gnd refout 0.1 f ref_p ref_n com_ 0.1 f 0.1 f 0.1 f 2.2 f 0.1 f 10 f 0.1 f max12529 max6029 (euk21) max12529 figure 12. external buffered (max4230) reference drive using a max6029 bandgap reference
max12529 buffered external reference drives multiple adcs the buffered external reference mode allows for more control over the max12529 reference voltage and allows multiple converters to use a common reference. the refin input impedance is > 50m . figure 12 shows the max6029 precision 2.048v bandgap reference used as a common reference for multiple con- verters. the 2.048v output of the max6029 passes through a single-pole 10hz lp filter to the max4230. the max4250 buffers the 2.048v reference and pro- vides additional 10hz lp filtering before its output is applied to the refin input of the max12529. dual, 96msps, 12-bit, if/baseband adc 24 ______________________________________________________________________________________ max12529 max4230 max6029 (euk30) 0.1 f 1 5 2 0.47 f 10 f 6v 47 1.47k 2.413v 3v 4 1 3 330 f 6v max4230 10 f 6v 47 1.47k 1.647v 4 1 3 330 f 6v max4230 10 f 6v 47 1.47k 0.880v 4 1 3 330 f 6v ref_p ref_n com_ v dd gnd refin 3.3v 3.3v refout 0.1 f 0.1 f 0.1 f 10 f 0.1 f 2.2 f 0.1 f 20k 1% 20k 1% 20k 1% 20k 1% 20k 1% 52.3k 1% 52.3k 1% 0.1 f max12529 ref_p ref_n com_ v dd gnd refin refout 0.1 f 0.1 f 0.1 f 10 f 0.1 f 2.2 f 0.1 f 0.1 f figure 13. external unbuffered reference driving multiple adcs input frequency range c in component values (pf) r in component values ( ) < 10mhz 12 to 22 0 10mhz to 125mhz 12 50 > 125mhz 5.6 0 table 4. component selection to enhance the frequency-range specific ac performance
unbuffered external reference drives multiple adcs the unbuffered external reference mode allows for pre- cise control over the max12529 reference and allows multiple converters to use a common reference. connecting refin to gnd disables the internal reference, allowing ref_p, ref_n, and com_ to be driven directly by a set of external reference sources. figure 13 uses a max6029 precision 3.000v bandgap reference as a common reference for multiple convert- ers. a seven-component resistive divider chain follows the max6029 voltage reference. the 0.47? capacitor along this chain creates a 10hz lp filter. three max4230 amplifiers buffer taps along this resistor chain providing 2.413v, 1.647v, and 0.880v to the max12529 ref_p, ref_n, and com_ reference inputs. the feed- back around the max4230 op amps provides addition- al 10hz lp filtering. reference voltages 2.413v and 0.880v set the full-scale analog input range for the con- verter to ?.022v (?v ref_p - v ref_n ] x 2/3). note that one single power supply for all active circuit components removes any concern regarding power- supply sequencing when powering up or down. grounding, bypassing, and board layout the max12529 requires high-speed board layout design techniques. refer to the max12527/max12528/ max12529/max12557/max12558/max12559 ev kit data sheet for a board layout reference. locate all bypass capacitors as close to the device as possible, preferably on the same side as the adc, using surface- mount devices for minimum inductance. bypass v dd to gnd with a 220? ceramic capacitor in parallel with at least one 10?, one 4.7?, and one 0.1? ceramic capacitor. bypass ov dd to gnd with a 220? ceramic capacitor in parallel with at least one 10?, one 4.7?, and one 0.1? ceramic capacitor. high-frequency bypassing/decoupling capacitors should be located as close as possible to the converter supply pins. multilayer boards with ample ground and power planes produce the highest level of signal integrity. all grounds and the exposed backside paddle of the max12529 package (package code: t6800-2) must be connected to the same ground plane. the max12529 relies on the exposed backside paddle connection for a low-induc- tance ground connection. isolate the ground plane from any noisy digital system ground planes such as a dsp or output buffer ground. route high-speed digital signal traces away from the sensitive analog traces. keep all signal lines short and free of 90 turns. ensure that the differential, analog input network layout is symmetric and that all parasitic components are balanced equally. refer to the max12529 ev kit data sheet for an example of symmetric input layout. parameter definitions integral nonlinearity (inl) inl is the deviation of the values on an actual transfer function from a straight line. for the max12529, this straight line is between the endpoints of the transfer function, once offset and gain errors have been nulli- fied. inl deviations are measured at every step of the transfer function and the worst-case deviation is report- ed in the electrical characteristics table. differential nonlinearity (dnl) dnl is the difference between an actual step width and the ideal value of 1 lsb. a dnl error specification of less than 1 lsb guarantees no missing codes and a monotonic transfer function. for the max12529, dnl deviations are measured at every step of the transfer function and the worst-case deviation is reported in the electrical characteristics table. offset error offset error is a figure of merit that indicates how well the actual transfer function matches the ideal transfer function at a single point. ideally, the midscale max12529 transition occurs at 0.5 lsb above mid- scale. the offset error is the amount of deviation between the measured midscale transition point and the ideal midscale transition point. gain error gain error is a figure of merit that indicates how well the slope of the actual transfer function matches the slope of the ideal transfer function. the slope of the actual trans- fer function is measured between two data points: posi- tive full scale and negative full scale. ideally, the positive full-scale max12529 transition occurs at 1.5 lsbs below positive full scale, and the negative full-scale transition occurs at 0.5 lsb above negative full scale. the gain error is the difference of the measured transition points minus the difference of the ideal transition points. small-signal noise floor (ssnf) ssnf is the integrated noise and distortion power in the nyquist band for small-signal inputs. the dc offset is excluded from this noise calculation. for this converter, a small signal is defined as a single tone with an ampli- tude of -35dbfs. this parameter captures the thermal and quantization noise characteristics of the data con- verter and can be used to help calculate the overall noise figure of a digital receiver signal path. max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 25
max12529 signal-to-noise ratio (snr) for a waveform perfectly reconstructed from digital samples, the theoretical maximum snr is the ratio of the full-scale analog input (rms value) to the rms quantization error (residual error). the ideal, theoretical minimum analog-to-digital noise is caused by quantiza- tion error only and results directly from the adc? reso- lution (n bits): snr [max] = 6.02 n + 1.76 in reality, there are other noise sources besides quanti- zation noise: thermal noise, reference noise, clock jitter, etc. snr is computed by taking the ratio of the rms signal to the rms noise. rms noise includes all spec- tral components to the nyquist frequency excluding the fundamental, the first six harmonics (hd2 through hd7), and the dc offset. snr = 20 x log (signal rms / noise rms ) signal-to-noise plus distortion (sinad) sinad is computed by taking the ratio of the rms sig- nal to the rms noise plus distortion. rms noise plus distortion includes all spectral components to the nyquist frequency excluding the fundamental and the dc offset. total harmonic distortion (thd) thd is the ratio of the rms sum of the first six harmon- ics of the input signal to the fundamental itself. this is expressed as: where v 1 is the fundamental amplitude, and v 2 through v 7 are the amplitudes of the 2nd- through 7th-order harmonics (hd2 through hd7). spurious-free dynamic range (sfdr) sfdr is the ratio expressed in decibels of the rms amplitude of the fundamental (maximum signal compo- nent) to the rms value of the next largest spurious component, excluding dc offset. 3rd-order intermodulation (im3) im3 is the power of the 3rd-order intermodulation product relative to the input power of either of the two input tones f in1 and f in2 . the individual input tone power levels are set to -7dbfs for the max12529. the 3rd-order inter- modulation products are 2 x f in1 - f in2 and 2 x f in2 - f in1 . aperture jitter figure 14 shows the aperture jitter (t aj ), which is the sample-to-sample variation in the aperture delay. aperture delay aperture delay (t ad ) is the time defined between the rising edge of the sampling clock and the instant when an actual sample is taken (figure 14). full-power bandwidth a large -0.2dbfs analog input signal is applied to an adc and the input frequency is swept up to the point where the amplitude of the digitized conversion result has decreased by -3db. this point is defined as full- power input bandwidth frequency. output noise (n out ) the output noise (n out ) parameter is similar to thermal plus quantization noise and is an indication of the con- verter? overall noise performance. no fundamental input tone is used to test for n out . in_p, in_n, and com_ are connected together and 1024k data points are collected. n out is computed by taking the rms value of the collected data points after the mean is removed. overdrive recovery time overdrive recovery time is the time required for the adc to recover from an input transient that exceeds the full-scale limits. the max12529 specifies overdrive recovery time using an input transient that exceeds the full-scale limits by ?0%. the max12529 requires one clock cycle to recover from an overdrive condition. crosstalk crosstalk is coupling onto one channel being driven by a (-1dbfs) signal when the adjacent interfering channel is driven by a full-scale signal. measurement includes all spurs resulting from both direct coupling and mixing components. thd vvvvvv v log = +++++ ? ? ? ? ? ? ? ? 20 2 2 3 2 4 2 5 2 6 2 7 2 1 dual, 96msps, 12-bit, if/baseband adc 26 ______________________________________________________________________________________ t ad t aj t/h track hold hold clkn clkp analog input sampled data figure 14. t/h aperture timing
gain matching gain matching is a figure of merit that indicates how well the gains between the two channels are matched to each other. the same input signal is applied to both channels and the maximum deviation in gain is report- ed (typically in db) as gain matching. offset matching like gain matching, offset matching is a figure of merit that indicates how well the offsets between the two chan- nels are matched to each other. the same input signal is applied to both channels and the maximum deviation in offset is reported (typically in %fsr) as offset matching. max12529 dual, 96msps, 12-bit, if/baseband adc ______________________________________________________________________________________ 27 41 42 43 44 45 37 38 39 40 46 21 22 23 24 25 26 27 28 29 30 v dd inap n.c. thin qfn top view n.c. dav ov dd dorb d11b d10b d9b d8b d7b 35 36 d6b d5b gnd inan coma gnd refan refap refbn gnd comb refbp gnd gnd inbn d0b n.c. n.c. ov dd v dd v dd v dd v dd div4 div2 18 19 20 clkp clkn exposed paddle (gnd) v dd ov dd dora d11a d10a refout shref pd v dd d9a d8a d7a d6a 31 d1b d5a 47 d0a 48 49 50 d3a d2a d1a 51 d4a 6 5 4 3 210 9 8 7 112 11 15 14 13 inbp gnd 17 16 32 33 d3b d2b 34 d4b 62 61 60 59 58 57 56 55 54 53 67 66 65 64 63 52 refin 68 max12529 gnd diffclk/seclk g/t pin configuration
max12529 dual, 96msps, 12-bit, if/baseband adc 28 ______________________________________________________________________________________ package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .) 68l qfn thin.eps package outline 21-0142 2 1 e 68l thin qfn, 10x10x0.8mm
max12529 dual, 96msps, 12-bit, if/baseband adc maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 ____________________ 29 2007 maxim integrated products is a registered trademark of maxim integrated products, inc. package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .) package outline 21-0142 2 2 e 68l thin qfn, 10x10x0.8mm boblet revision history pages changed at rev 1: 1?, 7?1, 28, 29
e nglish ? ???? ? ??? ? ??? what's ne w p roducts solutions de sign ap p note s sup p ort buy comp any me mbe rs max12529 part number table notes: see the max12529 quickview data sheet for further information on this product family or download the max12529 full data sheet (pdf, 372kb). 1. other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales . 2. didn't find what you need? ask our applications engineers. expert assistance in finding parts, usually within one business day. 3. part number suffixes: t or t&r = tape and reel; + = rohs/lead-free; # = rohs/lead-exempt. more: see full data sheet or part naming c onventions . 4. * some packages have variations, listed on the drawing. "pkgc ode/variation" tells which variation the product uses. 5. part number free sample buy direct package: type pins size drawing code/var * temp rohs/lead-free? materials analysis max12529etk-td -40c to +85c rohs/lead-free: no max12529etk+d thin qfn;68 pin;10x10x0.8mm dwg: 21-0142e (pdf) use pkgcode/variation: t6800+4 * -40c to +85c rohs/lead-free: yes materials analysis max12529etk+td thin qfn;68 pin;10x10x0.8mm dwg: 21-0142e (pdf) use pkgcode/variation: t6800+4 * -40c to +85c rohs/lead-free: yes materials analysis MAX12529ETK-D thin qfn;68 pin;10x10x0.8mm dwg: 21-0142e (pdf) use pkgcode/variation: t6800-4 * -40c to +85c rohs/lead-free: no materials analysis didn't find what you need? c ontac t us: send us an email c opyright 2 0 0 7 by m axim i ntegrated p roduc ts , dallas semic onduc tor ? legal n otic es ? p rivac y p olic y

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